Box Build
T&T is an ISO9001 & AS9100 certified and ITAR registered contract manufacturer that provides fully integrated box build (system build) assembly services including enclosure fabrication, high precision machining, circuit board assembly, wire/cable assembly, and electromechanical assembly. We can also accommodate installation of subassemblies, hardware, connectors/switches, routing of cabling, wire harnesses, and fiber optics. Box build programs are product centric, utilizing lean manufacturing principles to establish a cost effective assembly process while ensuring your unique manufacturing requirements for your product will not be compromised.
Whether you’re seeking assistance with a specific sub-assembly or desire a solution that encompasses a complete box build solution, we’ll work closely with your staff to ensure smooth integration with your internal manufacturing capabilities. We can support requirements from small mechanical assemblies, to over-sized rack or cabinet assemblies, to break-out boxes or backplanes, to complex circuit board assembly, or to a complete system build with an integrated supply chain and inventory solution. We also specialize in mechatronics based systems that integrate moving mechanical parts with electronic controls, precision interlocks, wiring, brackets and fitments, chassis containing PCBs, and precision machined metal parts containing sophisticated electronics.
Box build programs can be established around your specific needs and include all or specific
aspects of:
Prototyping/NPI – Prototyping and NPI support, allowing for seamless integration into an overall manufacturing solution. For customers requiring quick-turn prototype assembly, we can accommodate a 24-hour turnaround upon acquisition of all material.
Program design – Product assembly concept, lean process analysis, traceability, product testing and incoming/outgoing inspection, tooling acquisition.
Material management/Supply chain solution – Component acquisition, preassembled parts build up, cost analysis and reduction strategies, lead-time assessment & management, inventory bonding, kitting, vendor managed inventory programs, Kan Ban, Min/Max, JIT finished goods inventory solutions, local and global solutions.
Circuit board assembly – Rigid, flexible, and flex-rigid circuit boards. Single sided, double side, surface mount, through hole, mixed technology containing surface mount and through hole components on the same board.
Electromechanical assembly – Bench top, floor static and rotating assembly, sub-assembly integration, interlocks & fasteners, wire routing, mechatronics systems.
Fabrication – Loose parts, enclosures, forming, rolling, cutting, binding, fastening, crimped seam, welding, loose parts final assembly.
High precision machining – CNC lathe, milling, and cutting. Loose parts, shaping, turning, drilling, planning, boring, broaching, loose parts final assembly.
Wire and cable assembly – Harnessing, bundling, routing, hand-soldering, termination, overmolding, integration into sub-assemblies.
Testing/Inspection – Functional, in-circuit, solder joint, optical, continuity, specialized testing requirements.
Finishing – Plating, powder coating, painting, silk screening, custom colors, decals.
Labeling and serializing – Component level, board level, wire/cable, chassis, enclosure.
Programming – Electronic component programming.
Circuit Board Assembly
Whether you have small quantity or prototyping requirements, or have production volume requirements, we can assist you throughout the production process. Our capabilities include surface mount, through hole and mixed technology circuit board assemblies (that utilize both surface mount and through hole components) as well as single or double sided component placement, high component density boards, and flex circuit boards. We also specialize in complex hand-solder applications that require intricate component placement, wiring, or elctromechanical integration.
For customers requiring quick-turn prototype assembly, we can accommodate a 24-hour turnaround upon acquisition of all material. We can also further assist you with gearing up for production by establishing an assembly process based on lean manufacturing principles, material cost & lead-time analysis, material lifecycle analysis, and an integrated supply chain program utilizing a Min/Max, Kan Ban, Just-in-time, or consignment solution.
Surface Mount
T&T provides complete surface mount assembly services (per J-STD-001, IPC-A-610 II or III) and can accommodate double-sided board component placement, fine pitch placement and all component packages. Our services include assembly of mixed technology boards containing both surface mount and through hole components or assemblies requiring intricate hand-soldering. We also offer prototyping programs that include quick turnaround, trouble-shooting, manufacturing engineering, and establishing a manufacturing solution for your product. We closely monitor our manufacturing environment for variables such as temperature and humidity to minimize the impact of environmental factors as well as have an active FOD prevention program. We also implement comprehensive ESD standards to protect components from electrostatic discharge. We can accommodate:
Circuit Board Types:
Rigid, flex, and flex-rigid combination
Single and double-sided component placement
Up to 20"x18" (508mm x 457.2mm)
High-density large panel assembly
Custom board sizes, shapes, and materials
Component Packages:
BGA (ceramic, metal, plastic)
Micro-BGA
0201 chip placement
SOIC
PLCC
QFP
CSP
Placement and specialized capabilities:
Flip chip
Direct chip attach and chip on board (COB)
BGA (double sided BGA, mirror BGA, FPBGA, HBGA,)
Chip scale package (CSP) assembly
Wafer scale CSP (WLCSP) assembly
Component programming
Optoelectronics assembly
Fiber splicing
Through Hole
For customers requiring through-hole assembly services, we have a dedicated team available to assist you with low to higher volume assemblies (per J-STD-001, IPC-A-610 II or III), utilizing manual component insertion or automated insertion equipment for axial, radial, dip, and quad leaded components. Our team is specially trained to handle, form, cut, and insert components per your requirements. We can assist you with assemblies requiring intricate hand soldering of components, wires, or hardware, as well as selective lead soldering or requirements for strong mechanical bonds. We also specialize in high density, mixed technology, or double-sided boards.
T&T also offers prototyping programs that include quick turnaround, trouble-shooting, manufacturing engineering, and establishing a manufacturing solution for your product. We closely monitor our manufacturing environment for variables such as temperature and humidity to minimize the impact of environmental factors as well as have an active FOD prevention program. We also implement comprehensive ESD standards to protect components from electrostatic discharge.
Rigid, flex, and flex-rigid combination
Single and double-sided component placement
Mixed technology insertion (surface mount and through hole)
Manual electromechanical and mechatronic assembly
Intricate hand solder assemblies
Up to 20"x18" (508mm x 457.2mm)
High-density large panel assembly
Custom board sizes, shapes, and materials
Component programming